CHIP QUIK No-Clean Lead-Free Solder Paste, Sn96.5/Ag3/Cu0.5, 50g Jar

The CHIP QUIK No-Clean Lead-Free Solder Paste is a high-performance solder paste designed for efficient and reliable electronics assembly. This solder paste is supplied in a convenient 50g jar and is ideal for various soldering applications where cleanliness and ease of use are paramount.

With no-clean properties, this solder paste eliminates the need for post-soldering cleaning, reducing both time and cost. It features excellent wetting compatibility with most board finishes, ensuring strong and reliable solder joints. The low voiding characteristic enhances electrical conductivity and mechanical strength.

Key Features:

• Printing speeds up to 100mm/sec for high-efficiency assembly
• Long stencil life reduces the need for frequent replacements
• Wide process window for versatile applications
• Clear residue that does not require cleaning
• Dispense grade for easy application
• Compatible with enclosed print heads for precision work

Performance and Compatibility:

• Passes BONO test @ 1.56% for reliability
• Shelf life: >6 months when refrigerated, >2 months at room temperature
• Flux Type: Synthetic No Clean
• Solder Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu
• Melting Temperature: 220°C

Whether you're working on professional PCB assembly or DIY electronics projects, this solder paste delivers consistent performance and superior results.