CHIP QUIK No-Clean Solder Paste Sn42/Bi57.6/Ag0.4, 60g T4

The CHIP QUIK No-Clean Solder Paste offers a high-performance, lead-free solution for your soldering needs. With a composition of Sn42/Bi57.6/Ag0.4, this solder paste is perfect for applications requiring precision and reliability. The synthetic no-clean flux ensures minimal residue, eliminating the need for post-soldering cleaning.

Featuring an 87% metal content by weight, this solder paste provides excellent conductivity and strong solder joints. The T4 particle size (20-38 microns) makes it ideal for fine-pitch applications, ensuring precise placement and minimal bridging.

This product comes as a two-part mix, offering convenience and extended shelf life. When stored unrefrigerated, it has a shelf life of 2 years before mixing and more than 6 months when refrigerated after mixing. For optimal performance, use within 2 months if stored unrefrigerated after mixing.

With a low melting temperature of 138°C, this solder paste is suitable for heat-sensitive components, reducing the risk of thermal damage. The no-clean flux classification (REL0) ensures compliance with industry standards while maintaining excellent soldering performance.