Showing 14431-14440 of 17235 products
CHIP QUIK
Premium no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) for PCB assembly. 250g jar, T3 mesh, 220°C melting point.
High-quality no-clean lead-free solder paste (Sn96.5/Ag3/Cu0.5) in 50g jar. Ideal for PCB assembly and precision soldering.
No-clean, low-temp solder paste (138°C) for PCBs. Lead-free, 10cc syringe with plunger & tip. Refrigerated shelf life: 6+ months.
CHIP QUIK low-temp solder paste (138°C) for delicate electronics. No-clean, lead-free, 50g jar. Ideal for PCB assembly.
CHIP QUIK's lead-free solder paste (138°C) for delicate electronics. No-clean, syringe-applied with precision tip.
High-quality lead-free solder paste in syringe for precise applications. Sn96/Ag3/Cu0.5 alloy with 220°C melting point.
CHIP QUIK lead-free, no-clean solder paste with T4 mesh. Thermally stable, 50g jar for reliable soldering.
Reusable CHIP QUIK squeegee for precise solder paste application on SMT footprint pads. Flexible and compact.
Low-melting (118°C) lead-free indium solder wire (0.8mm), ideal for precision soldering & SMD work. Includes SMD291 flux.
High-quality lead-free solder wire (0.8mm, 28g) with no-clean flux—ideal for PCBs and precision soldering.
