TAIWAN SEMICONDUCTOR Bridge Rectifier, Glass Passivated, Single Phase, SIP, 4 P - 200 4
Glass passivated single phase bridge rectifier, 6A forward current, 200V reverse voltage, SIP through hole, for reliable AC to DC conversion.
The TAIWAN SEMICONDUCTOR bridge rectifier is a glass passivated, single phase device designed for reliable AC to DC conversion in a wide range of electronic applications. Housed in a compact SIP (Single Inline Package) with 4 pins, it offers efficient performance and straightforward through hole mounting for robust PCB integration.
This bridge rectifier delivers an average forward current of 6A and a repetitive peak reverse voltage of 200V, making it suitable for general purpose power supply and rectification tasks. With a maximum forward voltage of just 1V and a forward surge current rating of 175A, it provides efficient operation and resilience during transient conditions.
The glass passivated chip ensures stable, long term performance, while the operating temperature range up to 150°C allows for use in demanding environments. This component is part of the GBU60x series, known for dependable quality in power conversion.
Key Features
- Single phase bridge rectifier
- Glass passivated chip for reliability
- Compact SIP case style with 4 pins
- Through hole mounting for easy PCB assembly
- Average forward current: 6A
- Repetitive peak reverse voltage: 200V
- Forward surge current: 175A
- Operating temperature up to 150°C
Variant Details
- Size: 200 4
- Power Management circuits
- AC to DC power supply units
- Printed circuit board (PCB) assemblies
- Aerospace electronic systems
- Product Range: GBU40x Series
- Bridge Rectifier Case Style: SIP
- Bridge Rectifier Mounting: Through Hole
- No. of Phases: Single Phase
- No. of Pins: 4 Pins
- Repetitive Peak Reverse Voltage: 200V
- Maximum RMS Voltage: 140V
- Average Forward Current: 4A
- Forward Voltage Max: 1V
- Forward Surge Current: 150A
- Operating Junction Temperature Range: -55°C to 150°C
- Flammability Rating: UL94V-0
- Terminal Standard: Solderable per MIL-STD-750, Method 2026
- High-Temperature Soldering: Guaranteed 250°C for 10 seconds
- Body Material: Moulded plastic case
- Junction Type: Glass passivated
- Dimensions (approx.): 33mm (W) x 43mm (H) x 15mm (D)
- of Pins: 4Pins
- Operating Temperature Max: 150°C
- SVHC: No SVHC (17-Jan-2023)
Documents
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