T GLOBAL Thermal Gap Filler Sheet - 1.5mm
Soft, compressible T GLOBAL thermal gap filler sheet for heat dissipation & insulation in PCs, LEDs, PSUs & more. 2.2W/m.K conductivity.
The T GLOBAL Thermal Gap Filler Sheet is a soft, highly compressible interface material designed for efficient thermal management and electrical insulation in advanced electronic applications. This easy-to-assemble sheet is engineered to fill microscopic air gaps between heat-generating components and heat sinks or enclosure walls, significantly improving the conduction of heat away from sensitive parts.
Its key function is as a shock and vibration absorber, protecting delicate ICs, CPUs, and MOSFETs from mechanical stress while ensuring continuous thermal contact. The material excels at dissipating heat from high-performance components such as LEDs, motherboards, power supply units (PSUs), televisions, personal computers, network hubs, mobile handsets, and memory hard drives, preventing overheating and enhancing system reliability and longevity.
Technical Properties & Features
- Material Composition: A specialised, soft silicone-based compound offering high compressibility.
- Primary Function: Acts as a thermal interface material (TIM) and electrical insulator.
- Thermal Conductivity: Provides efficient heat transfer with a rating of 2.2W/m.K.
- Dielectric Strength: Offers excellent electrical insulation with a dielectric strength of 5kV/mm.
- Shore Hardness: Features a very soft durometer of Shore 10 for maximum conformability.
- Application Method: Simple to cut, shape, and apply, facilitating quick and reliable assembly in production or repair environments.
This gap filler sheet is an essential component for engineers seeking to optimise thermal performance, ensure electrical safety, and protect electronics from environmental stresses in a compact and effective form factor.
Variant Details
- Size: 1.5mm
- Thermal management for ICs, CPUs, and MOSFETs
- Heat dissipation from LEDs and motherboard components
- Cooling solutions for PSUs, TVs, and PCs
- Thermal interface in network hubs and mobile handsets
- Material: Soft, highly compressible silicone compound
- Primary Function: Thermal interface & electrical insulation
- Shore Hardness: 10
- Thermal Conductivity: 2.2W/m.K
- Dielectric Strength: 5kV/mm
- Product Range: H482
- SVHC: No SVHC (21-Jan-2025)
Always follow local regulations and product guidance.
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
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