Proto-Advantage PA0006C-N SOIC-16 to DIP-16 SMT Adaptor
Convert 16-pin SOIC to DIP with this gold-plated SMT adaptor. FR-4 PCB, precise pin alignment for reliable prototyping and testing.
Part of the Chip Quik Compact Series, the Proto-Advantage PA0006C-N is a high-precision surface mount adaptor designed to convert a 16-pin SOIC package to a 16-pin DIP footprint. This adaptor enables the prototyping, testing, and integration of surface-mount devices into through-hole applications, offering exceptional flexibility for electronics engineers and hobbyists.
The adaptor features a robust FR-4 UL94V-0 PCB construction, ensuring reliability and flame retardancy. For superior electrical performance and corrosion resistance, the machine pins on the bottom side come pre-installed and are gold plated with 1µm of gold over 50µm of nickel. These pins have a diameter of 0.46mm and a length of 3mm.
A key feature is the use of surface mount with partial through hole technology for pin installation. This innovative method guarantees exceptional positional accuracy, which is critical for maintaining signal integrity and ensuring a reliable connection between the adaptor and your target board.
Specifications & Features
- Construction: High-quality FR-4 UL94V-0 PCB.
- Pin Technology: Pre-installed bottom-side machine pins.
- Pin Finish: Gold plated (1µm Au over 50µm Ni) for excellent conductivity and durability.
- Pin Dimensions: 0.46mm diameter, 3mm long.
- Mounting Technology: Surface mount with partial through hole for precise alignment.
- PCB Dimensions: 1.6mm (Height) x 13.97mm (Width) x 20.32mm (Depth).
- Convert From: 16-pin SOIC (300 mil body, 1.27mm pitch).
- Convert To: 16-pin DIP (300 mil body, 0.1” pitch).
This compact and professionally manufactured adaptor is an essential tool for anyone working with mixed packaging technologies, facilitating easier development and debugging of electronic circuits.
- Prototyping SOIC devices on breadboards
- Testing surface-mount integrated circuits
- Integrating SMD components into through-hole designs
- Adapting modern IC packages for legacy equipment
- Convert From: 16-SOIC (300 mil body)
- Convert To: 16-DIP (300 mil body)
- Source Pitch Spacing: 1.27mm
- Pin Finish: Gold plated (1µm Au over 50µm Ni)
- Pin Diameter: 0.46mm
- Pin Length: 3mm
- Mounting Technology: Surface mount with partial through hole
- PCB Material: FR-4 UL94V-0
- PCB Dimensions (HxWxD): 1.6 x 13.97 x 20.32 mm
- Product Range: Compact Series
- From: 16-SOIC
- Pitch Spacing: 1.27mm
- SVHC: No SVHC (04-Feb-2026)
Documents
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