FISCHER ELEKTRONIK - Thermal Conductive Adhesive - 30g
Professional two-part epoxy adhesive. Thermally conductive (0.836 W/m·K) & electrically insulating. Replaces mechanical fastenings.
The FISCHER ELEKTRONIK - Thermal Conductive Adhesive is a high-performance, two-part epoxy resin adhesive designed for critical electronic and thermal management applications. This specially formulated adhesive is metal-oxide filled, providing excellent thermal conductivity while remaining electrically insulating, a crucial property for preventing short circuits in sensitive assemblies. It fully replaces traditional mechanical fastenings such as screws or clips, offering a cleaner, more uniform bond that distributes stress and thermal loads more effectively across the entire bonded area.
This adhesive boasts outstanding function and application characteristics, ensuring reliable performance in demanding environments. Its ease of use from a bottle dispenser allows for precise application and controlled mixing of the activator and hardener components. Once cured, it forms a durable, permanent bond that effectively transfers heat away from components, making it an ideal solution for heat sinks, power semiconductors, LEDs, and other devices where efficient thermal dissipation is paramount.
The product's formulation is engineered for strength and stability, providing a robust interface that can withstand thermal cycling and mechanical stress. By eliminating the need for drilling and mechanical hardware, it simplifies assembly processes, reduces component count, and minimises potential points of failure. This makes it a preferred choice for manufacturers and engineers in the electronics, automotive, aerospace, and telecommunications industries seeking to enhance product reliability and longevity.
Offering a professional-grade solution, this thermal adhesive ensures your assemblies benefit from improved heat management and structural integrity. Its non-conductive electrical properties provide an added layer of safety and design flexibility, allowing it to be used in direct contact with live circuits without risk. For any applicationrequ
Variant Details
- Size: 30g
- Bonding heat sinks to CPUs, GPUs, and power semiconductors
- Securing and thermally managing LED assemblies
- Replacing mechanical fastenings in electronic assemblies
- Automotive and aerospace electronics thermal management
- Type: Thermally Conductive, Electrically Non-Conductive Adhesive
- Composition: Two-Part Epoxy Resin, Metal-Oxide Filled
- Thermal Conductivity: 0.836 W/m·K
- Dispensing Method: Bottle
- Weight: 30g
- Adhesive epoxy Adhesive Type: Activator / Hardener
- SVHC: No SVHC (25-Jun-2025)
Always follow local regulations and product guidance.
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
View Full Delivery & Returns PolicySecure Transactions
We take the utmost care with your payment and personal details. Our website employs advanced encryption technology, including Secure Sockets Layer (SSL), to protect your information during transmission. You can verify a secure connection by looking for 'https' and a locked padlock in your browser.
Cookie Policy
Cookies enhance your shopping experience by keeping track of your basket and remembering you when you return. We also use banner advertising based on your browsing history to present products of potential interest.
Security Warning
Beware of phishing scams! We will never ask for personal details via email. If such information is required, we'll request you to contact us by phone. If you receive an email requesting sensitive information, do not respond and let us know immediately.
Recommended Products
Similar Products
You may like
