BOYD BGA 10 Heatsink with Pad - 23 x 23
Efficient aluminium BGA heatsink with pad by BOYD. Features pin-fin array for omni-directional airflow & peel-and-stick tape mounting to save board space.
The BOYD BGA Heatsink with Pad is designed to deliver efficient thermal management for Ball Grid Array (BGA) packages. Constructed from high-quality aluminium, this heatsink effectively draws heat away from sensitive electronic components, ensuring optimal performance and longevity for your devices.
One of the standout features of this heatsink is its innovative pin-fin array. This design allows for omni-directional airflow, which maximises heat dissipation regardless of the orientation of the fan or natural convection within the enclosure. This makes it highly versatile for various system configurations where airflow direction may vary.
Installation is both quick and clean thanks to the convenient peel-and-stick assembly. The thermally conductive tape mounting eliminates the need for drilling mounting holes, which not only saves valuable board space but also simplifies the design and manufacturing process. This adhesive method provides a secure and reliable bond to the component, ensuring consistent thermal contact over the product's lifespan.
Ideal for a wide range of electronics and computing applications, the BOYD BGA Heatsink with Pad offers a professional, space-saving, and highly effective cooling solution for your BGA packages.
Variant Details
- Size: 23 x 23
- Packages Cooled: BGA
- Heat Sink Material: Aluminium
- Fin Design: Pin-Fin array
- Thermal Resistance: 40°C/W
- Fin Dimensions (LxW): 11x10mm
- Mounting Type: Tape mounting (Peel and stick)
- Weight: 65 grams
- Height: 43 mm
- Width: 33 mm
- Depth: 15 mm
- Resistance: 40°C/W
- SVHC: No SVHC (15-Jan-2019)
Always follow local regulations and product guidance.
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