WARTON Microprint P2010 No Clean Lead-Free Solder Paste, 40g Syringe

The WARTON Microprint P2010 No Clean Lead-Free Solder Paste is a high-performance solution designed for air and nitrogen reflow processes. Specially formulated to withstand higher processing temperatures required by SAC alloys, this solder paste ensures reliable, consistent performance across a variety of substrate materials, including Sn/Pb, Au/Ni, and OSP-treated finishes.

Key Features:

• Halogen-free composition, making it environmentally friendly and safer for workplace use.
• Slump-free with no solder balling, ensuring precise and clean solder joints.
• Compatible with both air and nitrogen reflow environments.
• Leaves clear probe-testable residue, facilitating easy inspection without residue interference.
• Provides excellent soldering performance with a 72-hour tack life, ensuring prolonged usability.
• 12-month refrigerated shelf life (when stored below 10°C), preserving product quality.
• Fast printing speed (20-100mm/sec), enhancing production efficiency.
• No clean formulation (ROM0 per J-STD-004), reducing post-soldering cleaning requirements.

Specifications:

• Flux Type: No Clean
• Solder Alloy Composition: Sn 96.5%, Ag 3%, Cu 0.5%
• Melting Temperature: 220°C
• Weight: 40g (auto syringe format).

Ideal for electronics assembly, PCB rework, and other high-precision soldering applications, this solder paste delivers superior performance while adhering to environmental and safety standards.