WARTON Microprint P2010 Lead-Free Solder Paste, 40g Syringe
WARTON's P2010 lead-free, no-clean solder paste for reflow. Halogen-free, fast-printing, with a 220°C melt point. Ideal for SMT & PCB assembly.
The WARTON Microprint P2010 Lead-Free Solder Paste is a high-performance, no-clean solder paste designed for air and nitrogen reflow processes. Developed for use with SAC alloys, it performs exceptionally well at higher processing temperatures. This solder paste is compatible with various substrate materials, including Sn/Pb, Au/Ni, and OSP-treated finishes, making it versatile for different soldering applications.
Key Features
- Halogen-free for improved reliability
- Slump-free with no solder balling, ensuring clean, precise soldering
- Suitable for both air and nitrogen reflow environments
- Leaves a clear, probe-testable residue for easy inspection
- Offers excellent soldering performance with a 72-hour tack life
- 12-month refrigerated shelf life when stored below 10°C
- Fast printing with speeds of 20-100mm/sec
- No-clean formulation meets ROM0 (J-STD-004) standards
With a melting temperature of 220°C, this solder paste ensures reliable joints for a variety of electronic assemblies. Its 40g syringe packaging makes it convenient for precise dispensing.
- Reflow soldering (air and nitrogen environments)
- PCB assembly
- Surface-mount technology (SMT) applications
- Hand soldering with syringe dispensing
- Halogen Free
- No Clean: ROM0 (J-STD-004)
- Flux Type: No Clean
- Solder Alloy: 96.5% Sn, 3% Ag, 0.5% Cu
- Melting Temperature: 220°C
- Weight: 40g
- Slump-free, no solder balling
- Suitable for air/nitrogen reflow
- Clear probe-testable residue
- 72-hour tack life
- 12-month refrigerated shelf life (<10°C storage)
Always follow local regulations and product guidance.
Free standard delivery on UK mainland orders. Express delivery options and international shipping available at checkout.
We offer a 30-day money-back guarantee on most products. For faulty items, contact us within 14 days for a replacement or refund.
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