Wakefield Thermal TO220 Heatsink, 3.8°C/W, 33mm x 43mm

The Wakefield Thermal TO220 Heatsink is engineered to provide an effective thermal management solution for TO-220 semiconductor packages. Its high thermal efficiency (3.8°C/W) ensures optimal heat dissipation, helping to maintain safe operating temperatures and extend the lifespan of sensitive electronic components.

Designed for space-constrained applications, this heatsink features a vertical mounting orientation, allowing for a compact installation footprint. The black anodised aluminium finish enhances both durability and thermal radiation properties, while the wave solderable pins are positioned on standard 25.4mm (1-inch) centres for easy and reliable integration into printed circuit boards during the assembly process.

Crafted from aluminium, the heatsink offers an excellent balance of lightweight construction and superior thermal conductivity. Its robust design is built to withstand the rigours of wave soldering and provide consistent performance in demanding environments, making it a reliable choice for power regulation, amplification, and other high-current applications.

Key Specifications:

• Thermal Resistance: 3.8°C/W
• Package Compatibility: TO-220
• Material: Aluminium
• Finish: Black Anodised
• Pin Centres: 25.4mm (wave solderable)
• Mounting: Vertical
• Dimensions: 33mm (Width) x 43mm (Height) x 15mm (Depth)
• Weight: 24 grams

This heatsink is an essential component for designers and engineers seeking a proven, off-the-shelf cooling solution that delivers reliable performance and facilitates efficient assembly.