T GLOBAL Thermal Gap Filler Pad, 150mm Square

The T GLOBAL Thermal Gap Filler Pad is a highly versatile and compressible interface material designed for efficient thermal management in electronic assemblies. Made from a soft, carbon-based compound, it easily conforms to uneven surfaces, ensuring optimal contact and heat conduction between components and heatsinks or enclosure walls.

This pad excels as a shock and vibration absorber, protecting sensitive ICs, CPUs, and MOS devices from physical stress. Its excellent electrical insulation properties make it safe for use in a wide array of applications, preventing short circuits while effectively transferring heat.

Key Applications

• Used between integrated circuits (ICs), central processing units (CPUs), and metal-oxide-semiconductors (MOS) and their heatsinks.
• Ideal for filling gaps between printed circuit boards (PCBs) and enclosure walls to aid heat dissipation.
• Effectively dissipates heat from high-power components such as LEDs, motherboards, power supply units (PSUs), televisions, personal computers, network hubs, mobile handsets, and memory hard drives.

The material's 3.2 W/m.K thermal conductivity ensures efficient heat transfer, helping to maintain lower operating temperatures and improve device reliability and longevity. Its soft Shore 20 hardness allows for high compressibility without damaging delicate components, making assembly straightforward and reliable.

With dimensions of 150mm x 150mm, this square pad can be easily cut to size for custom applications. As part of the T GLOBAL H486 product range, it represents a trusted solution for engineers and technicians requiring effective thermal interface management.