T GLOBAL Gap Filler 1x150mm Sq

The T GLOBAL Gap Filler is a highly compressible, soft material designed to provide excellent electrical insulation while effectively absorbing shock and vibration. Easy to assemble, this thermal interface material is an ideal solution for managing heat transfer in a wide variety of electronic applications.

Specifically formulated for use on ICs, CPUs, and MOS devices, it facilitates efficient heat conduction between printed circuit boards and enclosure walls. The filler is highly effective for dissipating heat from critical hardware, including LEDs, motherboards, power supply units (PSUs), TVs, PCs, hubs, handsets, and memory hard drives.

With a thermal conductivity of 4W/m.K and a dielectric strength of 5kV/mm, it offers reliable performance for demanding environments. The material features a Shore hardness of 20, ensuring a conformal fit between uneven surfaces to maximise thermal transfer.

Key Specifications

• Thermal Conductivity: 4W/m.K
• Dielectric Strength: 5kV/mm
• Shore Hardness: 20
• Dimensions: 43mm (H) x 33mm (W) x 15mm (D)
• Weight: 54 grams

Whether you are assembling consumer electronics or building a custom PC, this gap filler provides a dependable and efficient thermal management solution.