QUALITEK 818 Low Residue No-Clean Solder Paste, 250g

The QUALITEK 818 Low Residue No-Clean Solder Paste is a high-performance formula specifically designed for surface mount and other electronic assembly applications. Its unique properties ensure excellent activity, long stencil life, extended tack time, high print speed, and prolonged shelf life.

Post-soldering residues are transparent, non-corrosive, and non-conductive, making this solder paste ideal for applications where minimal residue is crucial. The paste is Bellcore compliant, ensuring it meets industry standards for reliability and performance.

Features

• Long stencil life: 24-hour stencil life ensures consistent performance over extended use.
• Excellent wetting on OSP: Provides reliable wetting on Organic Solderability Preservatives (OSP).
• Extended tack time: 48-hour tack time allows for flexibility during assembly.
• Low residue: Leaves minimal post-soldering residue.
• Compatible with air or nitrogen reflow: Versatile for various reflow environments.

Applications

This solder paste is suitable for embedded design and development, hobby and education projects, and industrial applications where precision and reliability are key. Its high-quality formulation ensures optimal performance across a wide range of electronic assembly tasks.

Technical Specifications

• Solder Alloy: 62% Sn, 36% Pb, 2% Ag
• Melting Temperature: 125°C
• Weight: 250g

The QUALITEK 818 Low Residue No-Clean Solder Paste provides a professional solution for soldering needs, combining ease of use with high performance.