Proto-Advantage TSOC-6 to DIP-6 SMT Adaptor, 1.27mm Pitch

The Proto-Advantage TSOC-6 to DIP-6 SMT Adaptor (model PA0090) is a precision-engineered interconnect solution designed to bridge different package formats, offering exceptional flexibility for prototyping, testing, and small-scale production. This high-quality adaptor facilitates the conversion from a 6-pin TSOC (Thin Small Outline C) surface-mount footprint to a standard 6-pin DIP (Dual In-line Package) configuration, allowing for easy integration into breadboards, prototype boards, or sockets.

Supplied in an unassembled kit form, the adaptor provides users with maximum versatility. The package includes all necessary pins, requiring soldering for final assembly. This approach is ideal for engineers, technicians, and electronics enthusiasts who require a custom or bespoke interfacing solution. The fine 1.27mm (50 mil) pitch spacing ensures compatibility with modern, compact surface-mount components while maintaining reliable electrical connections.

Key Features & Applications

• Package Conversion: Seamlessly converts a 6-pin TSOC SMD footprint to a 6-pin DIP layout.
• Prototyping Friendly: Enables the testing and prototyping of surface-mount TSOC devices on through-hole boards.
• Unassembled Kit: Offers flexibility for custom assembly; all required pins are included.
• Fine Pitch Design: The 1.27mm pitch is suitable for high-density integrated circuits and modern electronic designs.
• Compact Dimensions: Its small form factor (33mm x 43mm) makes it suitable for space-constrained applications.

This adaptor is an indispensable tool for electronics development, rework stations, and educational labs, simplifying the process of working with varied component packages.