PROTO ADVANTAGE 150-Point Solder Breadboard, 2.54mm Pitch
High-quality 150-point solder breadboard with 2.54mm pitch for electronics prototyping and circuit testing.
The PROTO ADVANTAGE 150-Point Solder Breadboard is a high-quality, lead-free solderable breadboard ideal for prototyping and electronic circuit assembly. With its precise 2.54mm (0.1-inch) centre-to-centre hole pitch, it provides a structured layout for easy component placement and soldering.
Features & Benefits
- High-Quality Construction: Made from FR-4 UL94V-0 epoxy glass composite, ensuring durability and heat resistance up to 260°C during reflow soldering.
- Standard Hole Pitch: 2.54mm (0.1-inch) spacing for compatibility with common electronic components.
- Large Pad Size: 2.0mm (0.079-inch) round pads with 0.54mm (0.021-inch) spacing for secure soldering.
- Versatile Hole Compatibility: Accommodates 1mm (40 mils) soldered leads and 25 mil square wire wrap posts.
- Wide Operating Range: Functions reliably in temperatures from -40°C to +130°C.
- Compliant & Safe: RoHS 3 and REACH compliant, ensuring environmentally safe materials.
Technical Specifications
- Board Dimensions: 44.5mm (Height) x 27.9mm (Width)
- Board Thickness: 1.6mm
- Hole Diameter: 1mm (40 mils)
- Pad Diameter: 2.0mm (0.079-inch)
- Total Holes: 150 (15 rows × 10 columns)
- Max. Reflow Temp: 260°C
This PROTO ADVANTAGE Solder Breadboard is perfect for electronics enthusiasts, students, and professionals looking for a reliable and durable prototyping solution.
- Electronics prototyping
- Circuit testing
- Educational projects
- DIY electronics assembly
- Hole Pitch: 2.54mm (0.1-inch)
- Pad Size: 2.0mm (0.079-inch) round
- Pad Spacing: 0.54mm (0.021-inch)
- Hole Diameter: 1mm (40 mils)
- Board Material: Epoxy Glass Composite (FR-4 UL94V-0)
- Max. Reflow Temp: 260°C
- Operating Temp Range: -40°C to +130°C
- Board Thickness: 1.6mm
- Layout: 15 rows × 10 columns (150 holes)
- Weight: 10g
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