Multicomp Lead-Free Solder Wire, 1.2mm, 217°C, 250g
Multicomp lead-free solder wire, 1.2mm diameter, 250g roll. Halide-free, no-clean flux, 217°C melting point.
The Multicomp Lead-Free Solder Wire is a high-quality, halide-free soldering solution designed for users requiring superior performance with minimal residue. With a composition of 97.1% tin, 2.6% silver, and 0.3% copper, this solder wire ensures reliable and durable connections. The mildly activated no-clean flux formulation produces clear residues, making it ideal for applications where cleanliness is paramount.
This solder wire features fast soldering capabilities with excellent spread on copper, brass, and nickel surfaces. Its heat-stable properties reduce spitting, providing a smooth and efficient soldering experience. The Multicomp Type 400 variant is halide-free, while other types in the range (505 and 511) offer higher halide levels for increased soldering power.
Key Features
- Material Composition: 97.1% tin, 2.6% silver, 0.3% copper
- Flux Type: No-clean, rosin-based, low activation level
- Halide-Free: Multicomp Type 400 formulation
- Fast Soldering: Excellent spread on copper, brass, and nickel
- Heat Stable: Low spitting for clean application
- Clear Residues: Minimal post-soldering cleanup required
- Lead-Free: Compliant with international standards
- Electronics assembly
- Printed circuit board (PCB) soldering
- Copper, brass, and nickel surface applications
- Lead-free soldering projects
- Material Composition: 97.1% tin, 2.6% silver, 0.3% copper
- Flux Type: No-clean and rosin flux
- Halide Free: Type 400
- Lead Free: Yes
- External Diameter: 1.2mm
- Melting Temperature: 217°C
- Weight: 250g
- Solder Alloy: 97.1, 2.6, 0.3 Sn, Ag, Cu
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