Multicomp Pro Heatsink TO-220, 14°C/W, 43mm x 33mm x 15mm

The Multicomp Pro MC33263 Heatsink is a compact, extruded cooling solution designed for efficient thermal management of TO-220 semiconductor packages. With a black anodised finish, it offers both durability and improved heat dissipation.

Featuring solderable fixing pins, this heatsink provides flexible mounting options, allowing for secure installation via screws or clips. Its vertical mount design makes it an ideal choice for applications where space is at a premium, ensuring reliable performance in constrained environments.

The primary function of this component is to draw heat away from sensitive electronic devices, thereby extending their operational life and preventing thermal throttling. Its construction from high-quality extruded material ensures consistent thermal conductivity.

With its compact dimensions of 43mm x 33mm x 15mm and a weight of just 11 grams, it adds minimal bulk while providing effective cooling. The solderable pins offer a permanent and robust electrical connection if required for grounding purposes.

Key Specifications

• Thermal Resistance: 13.4°C/W
• Package Compatibility: Designed for TO-220 packages
• Mounting: Vertical orientation with screw or clip fixing
• Finish: Black anodised
• Pin Type: Solderable fixing pins
• Height: 43 mm
• Width: 33 mm
• Depth: 15 mm
• Weight: 11 grams

This heatsink is a practical and reliable component for maintaining optimal operating temperatures in a wide range of electronic assemblies.