Molex C-Grid III 18-Way 2-Row Vertical PCB Header 2.54mm

Molex C-Grid III 18-Way 2-Row Vertical PCB Header is a 2.54 mm pitch, through-hole printed circuit board header with 18 contacts arranged in two rows. It forms wire-to-board and board-to-board connections within the modular C-Grid III interconnection system.

Overview

The C-Grid III header is designed for electronic packaging applications that require flexible interconnection options. Its vertical, 18-way, 2-row layout gives engineers a range of alternatives for circuit design, and the header is part of the C-Grid III (90130 series) interconnect system.

Key Features

• Fully shrouded body that provides polarisation and protection for the mating pins
• Brass contacts with gold plating for conductivity and corrosion resistance
• Straight through-hole termination for a solder connection to the printed circuit board
• Accepts both discrete wire connectors and ribbon cable connectors
• Fully compatible with the DIN41651 specification and interchangeable with the Molex QF-50 product family
• Materials and construction meet stringent glow wire requirements

Applications

Suitable for wire-to-board and board-to-board connections in a range of electronic applications. The shroud helps prevent misalignment of mating pins during assembly.

Specifications

• Pitch: 2.54 mm
• Contacts: 18 in 2 rows
• Orientation: Vertical
• Dimensions: 3.3 (width) x 1.5 (depth) x 4.3 (height)
• Weight: 9 gm

Choose the Molex C-Grid III 18-Way 2-Row Vertical PCB Header when a shrouded, 2.54 mm pitch board header with DIN41651 compatibility is required for your circuit design.