LOCTITE GC 10 No-Clean Halogen-Free Solder Paste, 500g

The LOCTITE GC 10 No-Clean Halogen-Free Solder Paste is an advanced Pb-free SAC305T3 formulation designed for superior soldering performance across a wide range of temperature conditions. Its novel flux chemistry ensures long-term stability, enhancing field application yields and online paste utilisation while minimising voiding.

This solder paste exhibits excellent solderability in both air and nitrogen reflow environments, accommodating challenging surface finishes such as immersion Ag, OSP-Cu, ENIG, and CuNiZn. It effectively addresses industry-wide HiP (Head-In-Pillow) and NWO (Non-Wet Open) challenges, improving coalescence and wetting for very shiny, reliable solder joints.

Key Features:

• Halogen-free & no-clean flux (ROL0 per ANSI/J-STD-004 Rev. B)
• Low smoke and odour for improved workplace conditions
• Exceptional stencil life (72 hours) and abandon time (24 hours)
• Compatible with high-speed printing (up to 125 mm/s) and fine-pitch applications (0.3mm)
• Wide reflow process window (150-200°C soak), optimised for small components including 01005
• Produces clear, colourless residues for easy post-reflow inspection
• Residues remain print-testable even after 4 reflow cycles
• Alloy Composition: 96.5% Sn, 3% Ag, 0.5% Cu (melting point: 217°C)