Boyd PF527 Aluminium TO-3 Heatsink, 7.3°C/W

The Boyd PF527 Heatsink provides an efficient and compact cooling solution for TO-3 packaged components. Crafted from aluminium with a durable black anodised finish, it offers excellent thermal conductivity and corrosion resistance, ensuring long-term reliability in demanding electronic applications.

Its clever clamp-over design allows for easy installation directly onto a TO-3 case without the need to disconnect or disturb the existing device connections. This user-friendly feature simplifies assembly and maintenance. Crucially, the heatsink's low-profile construction uses almost no additional board space, making it an ideal choice for densely packed printed circuit boards (PCBs) where space is at a premium.

With a specified thermal resistance of 7.3°C/W, this heatsink effectively dissipates heat away from sensitive components, helping to maintain optimal operating temperatures and prevent thermal throttling or failure. Its primary application is in HVAC (Heating, Ventilation, and Air Conditioning) systems and general thermal management scenarios where controlling component temperature is vital for system performance and longevity.

Key Features:

• Material: High-quality aluminium for effective heat dissipation.
• Finish: Black anodised coating for durability and a professional appearance.
• Mounting: Clamp-over TO-3 case design for tool-free, non-invasive installation.
• Space-Saving: Minimal footprint preserves valuable PCB real estate.
• Thermal Performance: 7.3°C/W thermal resistance for efficient cooling.

The Boyd PF527 is a dependable, off-the-shelf thermal management component designed to enhance the stability and lifespan of your electronic assemblies.