BOYD Aluminium Heatsink for TO-218/220/247, 2.7°C/W

The BOYD Aluminium Heatsink is a high-power extruded cooling solution designed to efficiently dissipate heat from demanding electronic components. Featuring large radial fins and straight pins, this heat sink maximises surface area for optimal thermal management, ensuring your devices remain cool and operational under load.

Built with a quality extruded design, this component includes PCB pins for secure and stable mounting directly onto circuit boards. The aluminium construction offers excellent thermal conductivity while keeping the overall weight to a minimum, making it suitable for a variety of dense electronic assemblies.

With a thermal resistance of 2.7°C/W, this heatsink is specifically engineered to cool standard semiconductor packages, including TO-218, TO-220, and TO-247 profiles. Its compact dimensions make it highly versatile for integration into tight spaces, particularly within HVAC systems where reliable and continuous cooling is critical.

Key Specifications

• Thermal Resistance: 2.7°C/W
• Packages Cooled: TO-218, TO-220, TO-247
• Material: Aluminium
• Dimensions: 43 mm (H) x 33 mm (W) x 15 mm (D)
• Weight: 100 grams