BERGQUIST Gap Pad Thermal Interface Sheet, 100 x 100mm, 0.125 inch

The BERGQUIST Gap Pad is a high-performance thermal interface material designed to provide an effective thermal connection between heat sinks and electronic devices. It is specifically engineered for applications where uneven surface topography, air gaps, and rough surface textures are present, ensuring optimal heat transfer and device reliability.

This Gap Pad eliminates air gaps to significantly reduce thermal resistance, while its highly conformable nature minimises interfacial resistance. It also provides low-stress vibration dampening, protecting sensitive electronic components from mechanical damage. The adhesive backing ensures easy and secure installation, and the material is compatible with automated dispensing equipment for efficient manufacturing processes.

Supplied as a convenient 100 x 100mm sheet, this pad is ready for custom cutting and application. With a thermal conductivity of 0.8W/m.K, it delivers effective thermal management for a wide range of electronic applications.

Key Features

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resistance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment
• Adhesive backed for secure placement
• Supplied in a 100 x 100mm sheet

Specifications

• Thermal Conductivity: 0.8W/m.K
• Thickness: 0.125 inch (3.175mm)
• Size: 100 x 100mm sheet

This BERGQUIST Gap Pad is the ideal solution for engineers and manufacturers seeking reliable thermal management in demanding electronic assemblies.