BERGQUIST Gap Pad 3000 S30 Thermal Pad 0.125in 100mm x 100mm

The BERGQUIST Gap Pad 3000 S30 provides a highly effective thermal interface between heat sinks and electronic devices. It is specifically engineered for applications where uneven surface topography, air gaps, and rough surface textures are present, ensuring optimal contact and efficient heat dissipation.

This thermal pad is ideal when you require ultra-high thermal performance from a material that is both highly conformable and glass reinforced. By effectively eliminating air gaps, it significantly reduces thermal resistance and minimises interfacial resistance, enhancing the overall cooling efficiency of your electronic assemblies.

Additionally, the pad offers low-stress vibration dampening, which helps protect sensitive components from mechanical shock and operational vibrations. It is fully compatible with automated dispensing equipment, streamlining the manufacturing and assembly processes. Supplied as a convenient 100mm x 100mm sheet with a thickness of 0.125 inches, this pad is easy to handle and apply to various surfaces, making it a versatile choice for demanding electronic applications.