Amec Thermasol Ceramic Heatsink 30 x 30 x 5 mm with Thermal Tape

The Amec Thermasol Ceramic Heatsink 30 x 30 x 5 mm is a low-profile, lightweight, wave-type micro-porous ceramic heat sink designed for thermal management. Measuring 30 mm x 30 mm x 5 mm, its micro-porous structure provides a large surface area compared with conventional copper or aluminium heatsinks.

The ceramic construction allows heat to dissipate without being stored within the material itself, which supports efficient active cooling. It also has a lower thermal capacity per unit volume than metal heatsinks, allowing for a rapid thermal response.

Each unit is supplied pre-fitted with a thermally conductive silicone adhesive tape for straightforward mounting. The ceramic body is completely non-electrically conductive, which helps avoid short circuits and antenna effects in sensitive electronic circuits. Its low profile and minimal weight suit space-constrained and portable applications.

Key Features

• Micro-Porous Ceramic Construction: Provides a larger surface area than aluminium for heat dissipation into the surrounding air.
• Non-Conductive Body: Electrically insulating, helping to prevent short circuits and antenna effects in RF-sensitive circuits.
• Lightweight and Low Profile: Weighs 7.484 g with a 5 mm profile.
• Pre-Applied Adhesive Tape: Includes thermally conductive silicone adhesive tape for mounting.
• Low Thermal Capacity: Responds quickly to temperature changes without storing excess heat.

Specifications

• Dimensions: 30 mm x 30 mm x 5 mm
• Weight: 7.484 g

Choose the Amec Thermasol Ceramic Heatsink where compact, electrically non-conductive thermal management is required in electronic assemblies.