AMEC THERMASOL Ceramic Heatsink 22x22x2.5mm with Thermal Tape

The AMEC THERMASOL MPC222225T is a highly efficient, low-profile, and lightweight Micro-Porous Ceramic Heat Sink (MPCHS). Engineered for superior thermal management, its unique micro-porous ceramic structure provides an exceptionally large surface area relative to its compact size. This design ensures excellent heat dissipation while minimising heat storage within the unit itself, making it more responsive than traditional metal heatsinks.

A key advantage of this ceramic heatsink is its exceptionally low thermal capacity per unit volume compared to conventional copper or aluminium alternatives. This allows for rapid heat transfer and dissipation, crucial for protecting sensitive electronic components from thermal damage. It is supplied with a pre-applied, thermally conductive silicone adhesive tape for easy and secure mounting.

Key Features

• Superior Material: Constructed from advanced micro-porous ceramic for optimal heat dissipation.
• Large Surface Area: Its porous nature offers a significantly greater surface area than solid aluminium heatsinks of comparable size.
• Non-Conductive: The ceramic material is electrically non-conductive, eliminating risks of short circuits and preventing any antenna effect that could interfere with RF signals.
• Compact & Lightweight: With a slim 2.5mm profile and minimal weight, it is ideal for space-constrained and portable applications.
• Easy Installation: Includes a high-performance thermal silicone adhesive tape for a strong, permanent bond without the need for separate clips or screws.

This heatsink is perfectly suited for modern consumer electronics where efficient cooling, electrical isolation, and minimal footprint are paramount. It provides a reliable and effective thermal solution that enhances the longevity and stability of your electronic devices.